* 非接觸式去球，精確的低溫操作，無二次損傷綠漆和焊盤
     Non-touchdeballing, accurate low temperature control, non-damage process

* 錫球直徑最小可達0.25毫米，最小間距0.4毫米
     Sphere diameter up to 0.25mm，fine pitch up to 0.4mm

* 適于高鉛球，凹型封裝，層疊封裝等
     Suitable for all package HMP, S-CBGA, POP and so on

* 錫球品質均勻穩定，通過包括共面性等的原廠10項指標檢驗
     High reliability as virgin in sphere quality, take the inspection of 10 indexes including coplanarity

* 工藝已被航空，航天，核潛艇，F1方程式賽車等高可靠性要求場合驗證可靠
     Process has already been applied by Aerospace, Nuclear submarine, F1 race team