* 非接觸式去球,精確的低溫操作,無二次損傷綠漆和焊盤
Non-touchdeballing, accurate low temperature control, non-damage process
* 錫球直徑最小可達0.25毫米,最小間距0.4毫米
Sphere diameter up to 0.25mm,fine pitch up to 0.4mm
* 適于高鉛球,凹型封裝,層疊封裝等
Suitable for all package HMP, S-CBGA, POP and so on
* 錫球品質均勻穩定,通過包括共面性等的原廠10項指標檢驗
High reliability as virgin in sphere quality, take the inspection of 10 indexes including coplanarity
* 工藝已被航空,航天,核潛艇,F1方程式賽車等高可靠性要求場合驗證可靠
Process has already been applied by Aerospace, Nuclear submarine, F1 race team